From 93a64979d8ffa7fec586aa339c1b5a0e57d977d0 Mon Sep 17 00:00:00 2001 From: weichen Date: Mon, 12 Oct 2026 04:17:16 +0000 Subject: [PATCH] Bump pins for GenUI surface action param flatten hotfix Why: Ship Backend#174 (flatten action data for system.intent) and the usage-guide field-fix log into the prod redeploy combination. Evidence: Backend#174 @ 52d75fd; Documents#82; surfacesvc tests green Impact: Prod second-knife redeploy can validate B-class intent end-to-end. Refs: GenUI prod deploy; Backend#174; Documents#82 Co-authored-by: Cursor --- modules/backend | 2 +- modules/documents | 2 +- 2 files changed, 2 insertions(+), 2 deletions(-) diff --git a/modules/backend b/modules/backend index c7b30d21..52d75fd9 160000 --- a/modules/backend +++ b/modules/backend @@ -1 +1 @@ -Subproject commit c7b30d210977b754d05648c3f233ca156a5a8047 +Subproject commit 52d75fd93143ddb05c9f5035981b354a7577207f diff --git a/modules/documents b/modules/documents index 262d4673..bd5fb185 160000 --- a/modules/documents +++ b/modules/documents @@ -1 +1 @@ -Subproject commit 262d467362b07ca684824faa8169f95a6f06efeb +Subproject commit bd5fb185196e4fad5f9d7bf43f075e5965b03b95