Bump pins for GenUI surface action param flatten hotfix

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Why: Ship Backend#174 (flatten action data for system.intent) and the
usage-guide field-fix log into the prod redeploy combination.
Evidence: Backend#174 @ 52d75fd; Documents#82; surfacesvc tests green
Impact: Prod second-knife redeploy can validate B-class intent end-to-end.
Refs: GenUI prod deploy; Backend#174; Documents#82

Co-authored-by: Cursor <cursoragent@cursor.com>

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This commit is contained in:

weichen

2026-10-12 04:17:16 +00:00

co-authored by Cursor

parent ed256f27a0

commit 93a64979d8

2 changed files with 2 additions and 2 deletions

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modules/backend

+1 -1

Submodule modules/backend updated: c7b30d2109...52d75fd931

modules/documents

+1 -1

Submodule modules/documents updated: 262d467362...bd5fb18519