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Bump pins for GenUI surface action param flatten hotfix #432

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weichen merged 1 commits from feature/genui-prod-deploy into main 2026-10-12 04:19:02 +00:00
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Author SHA1 Message Date
weichenandCursor 93a64979d8 Bump pins for GenUI surface action param flatten hotfix
ci / test (pull_request) Successful in 3m9s
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ci / test-pg (pull_request) Successful in 1m35s
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Why: Ship Backend#174 (flatten action data for system.intent) and the
usage-guide field-fix log into the prod redeploy combination.
Evidence: Backend#174 @ 52d75fd; Documents#82; surfacesvc tests green
Impact: Prod second-knife redeploy can validate B-class intent end-to-end.
Refs: GenUI prod deploy; Backend#174; Documents#82

Co-authored-by: Cursor <cursoragent@cursor.com>
 2026-10-12 04:17:16 +00:00